When sourcing PCBs intended for powder coating environments or featuring specialized coatings, you must prioritize thermal stability and dielectric strength. Ensure the substrate is FR-4 High Tg (Glass Transition Temperature) if the board will undergo high-heat curing processes (typically 180°C to 200°C). The copper thickness (e.g., 1oz or 2oz) should be verified to handle current loads without delamination under thermal stress. Additionally, confirm the solder mask type, as it must be compatible with the powder coating chemistry to prevent outgassing or adhesion failure.